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Meet with Dan Voit at Pack Expo International

Daniel Voit
Daniel Voit, CEO, is looking forward to connecting with you at the show!

Blentech team members are getting ready to see you at the Pack Expo International show taking place October 23rd-26th at McCormick Place in Chicago. One of our team members at the Blentech booth (booth 7146) will be Blentech’s CEO, Daniel Voit. Dan has over 20 years of food industry experience.

Come on by to chat with Dan and the Blentech team about your current innovation, challenges, goals, or for a demonstration of our ARTIS™ technologies.

Use code 13G74 at registration to register for free! Want to set up a specific time to meet with our team? Contact us today to make an appointment on our booth. We look forward to seeing you at the show!

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